“Polymer thermal pastes are subject to thermal degradation, resulting in a lifespan of only 1-3 years. Their low thermal conductivity (typically 0.3-8 W/mK) results in insufficient heat dissipation. In-Bi-Sn alloys with higher K values are designed to eliminate the risk of thermal degradation and have no service life issues.

In-Bi-Sn alloy foils are used to address the heat dissipation issues faced by high-power electronics. This alloy is suitable for use in both solid and liquid phases, making it suitable for copper and aluminum substrates. Its measured thermal conductivity is 24.17 W/(m·K), and the problem of leakage during use has been resolved.”